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Electronic Devices Standardization

No.
Title
Download
Remarks
ED-4701/001 Environmental and endurance test methods for semiconductor devices (General) Only English version
ED-4701/100 Environmental and endurance test methods for semiconductor devices (Life test I) Only English version
ED-4701/200 Environmental and endurance test methods for semiconductor devices (Life test II) Only English version
ED-4701/300 Environmental and endurance test methods for semiconductor devices (Stress test I) Only English version
ED-4701/300-1 Environmental and endurance test methods for semiconductor devices (Stress test I) (Amendment 1) Only English version
ED-4701/300-2 Environmental and endurance test methods for semiconductor devices (Stress test I) (Amendment 2) Only English version
ED-4701/300-3 Environmental and endurance test methods for semiconductor devices (Stress test I) (Amendment 3) Only English version
ED-4701/400 Environmental and endurance test methods for semiconductor devices (Stress test II) Only English version
ED-4701/400-1 Environmental and endurance test methods for semiconductor devices (Stress test II)(Amendment 1) Only English version
ED-4701/500 Environmental and endurance test methods for semiconductor devices (Miscellaneous) Only English version
ED-4702A Mechanical stress test methods for semiconductor surface mounting devices Only English version
ED-4704 Failure mechanism driven reliability test methods for LSIs Only English version
ED-4704-1 Failure mechanism driven reliability test methods for LSIs (Amendment1) Only English version
ED-5001A 3.3V±0.3V (normal range) and 2.7V to 3.6V(wide range) Power supply voltage and interface standard for non-terminated digital integrated circuits Both Japanese & English
ED-5002A 2.5V±0.2V (normal range) and 1.8V to 2.7V (wide range) Power supply voltage and interface standard for non-terminated digital integrated circuits Both Japanese & English
ED-5003A 1.8V±0.15V (normal range), and 1.2V to 1.95V (wide range) power supply voltage and interface standard for nonterminated digital integrated circuit Both Japanese & English
ED-5004A 1.5V±0.1V (normal range) and 0.9V to 1.6V (wide range) power supply voltage and interface standard for nonterminated digital integrated circuit Both Japanese & English
ED-5005A 1.2V±0.1V (normal range) and 0.8V to 1.3V (wide range) power supply voltage and interface standard for nonterminated digital integrated circuit Both Japanese & English
ED-5006A 1.0V±0.1V (normal range) and 0.7V to 1.1V (wide range) power supply voltage and interface standard for nonterminated digital integrated circuit Both Japanese & English
ED-5302 Standard for I/O Interface Model for Integrated Circuits (IMIC) Only English version
ED-5512 Stub Series Terminated Logic for 3.3Volts (SSTL_3) (A 3.3V Supply Voltage based Interface Standard for Digital ICs) Only English version
ED-5513 Stub Series Terminated Logic for 2.5Volts (SSTL_2) (A 2.5V Supply Voltage based Interface Standard for Digital ICs) Only English version
ED-5514 Processor Enhanced Memory Module(PEMM) Standard for Processor Enhanced Memory Module Functional Specifications Only English version
ED-5515 Stub Series Terminated Logic for 2.5Volts (SSTL_2) Differential Input Signal Specifications Only English version
ED-7300 Recommended practice on standard for the preparation of outline drawings of semiconductor packages Only English version
ED-7301A Manual or the standard of integrated circuits package Only English version
ED-7302A Manual for integrated circuits package design guideline Only English version
ED-7303B Name and code for integrated circuits package Only English version
ED-7304 Measuring method for package dimensions of ball grid array (BGA) Only English version
ED-7304-1 Measuring method for package dimensions of Small Outline Package (SOP) Only English version
ED-7304-2 Measuring Method for Package Dimensions of Small Outline J-leaded Package (SOJ) Only English version
ED-7305 Unit design guide for the preparation of package outline drawing of integrated circuits (gullwing-lead) Only English version
ED-7306 Measurement methods of package warpage at elevated temperature and the maximum permissible warpage Only English version
ED-7311A Standards of integrated circuits package (P-QFP) Only English version
ED-7311-1 Standard of integrated circuits package (TSOP(1)) Only English version
ED-7311-2 Standard of integrated circuits package (TSOP(2)) Only English version
ED-7311-3A Standard of integrated circuits package (Tape Ball Grid Array1.0mm pitch(T-BGA)) Only English version
ED-7311-4A Standard of integrated circuits package (Tape Ball Grid Array1.27mm pitch (T-BGA)) Only English version
ED-7311-5A Standard of integrated circuits package (SRAM/Flash Fine- Pitch Ball Grid Array (FBGA)) Only English version
ED-7311-6 Standard of integrated circuits package (60/90pins Fine Pitch Ball Grid Array (FBGA)) Only English version
ED-7311-7 Standard of integrated circuits package (Plastic Fine Pitch Ball Grid Array 0.5mm pitch (P-FBGA)) Only English version
ED-7311-8 Standard of integrated circuits package (Plastic Fine Pitch Ball Grid Array 0.8mm pitch (P-FBGA)) Only English version
ED-7311-9A Standard of integrated circuits package (P-BGA (cavity up type)) Only English version
ED-7311-10A Standard of integrated circuits package (P-BGA (Cavity down type)) Only English version
ED-7311-11A Standard of integrated circuits package (119/153pins P-BGA) Only English version
ED-7311-12 Standard of integrated circuits package (52pins 64pins 80pins and 100pins Low-profile Quad Flat Package with Exposed Heatsink) Only English version
ED-7311-13A Standard of Integrated circuits package (P-SON) Only English version
ED-7311-16A Standard of integrated circuits package (C-LGA) Only English version
ED-7311-17 Standard of integrated circuits package (P-ZIP) Only English version
ED-7311-18 Standard of integrated circuits package (P-ILGA) Only English version
ED-7311-19 Standard of integrated circuits package (P-SOP) Only English version
ED-7311-20 Standard of integrated circuits package (P-SSOP) Only English version
ED-7311-21 Standard of integrated circuits package (P-HSOP) Only English version
ED-7311-22 Standards of integrated circuits package (P-QFN) Only English version
ED-7311-23 Standard of Integrated circuits package (PGA) Only English version
ED-7401-4 Method of measuring semiconductor device package dimensions (integrated circuits) Only English version
ED-7441B Standards for the packages of universal memory devices Only English version
ED-7500A Standards for the dimensions of semiconductor devices (discrete semiconductor devices) Only English version
ED-7500A-1 Standards for the dimensions of semiconductor devices (Discrete semiconductor devices) Only English version
ED-7500A-2 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices) Only English version
ED-7502 Manual for the preparation of outline drawings of discrete semiconductor packages Only English version
ED-7611 Tray for Thin Small Outline Packages Only English version
ED-7614 Tray for Quad Flat Packages Only English version
ED-7631 Marking method for recycle of semiconductor device packing magazines Only English version
ED-7701 Glossary of semiconductor socket for BGA,LGA,FBGA and FLGA Only English version
ED-7715 Standard of open-top type socket [54/66 Pin Thin Small Outline Packages (Type 2)] Only English version
ED-7716 Standard of open-top type socket [Fine-pitch Ball Grid Array (FBGA) for Memort IC] Only English version
EDR-4701B Handling guidance for semiconductor devices Only English version
EDR-4703 Quality Assurance Guidelines for Bare Die including KGD Only English version
EDR-4704 Guideline for accelerated endurance testing of semiconductor devices Only English version
EDR-4704A Application guide of the accelerated life test for semiconductor devices Only English version
EDR-4705 JEITA SER Testing Guideline Only English version
EDR-4706 Guide for the Reliability Speciffication of FLASH Memory Only English version
EDR-5202 ASIC performance evaluation guideline 1999.05 Only English version
EDR-7311A Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP) Only English version
EDR-7312 Design guideline of integrated circuits for thin small outline package (type1) (TSOPI) Only English version
EDR-7313 Design guideline of integrated circuits for thin small outline package (type 2) (TSOP2) Only English version
EDR-7314A Design guideline of integrated circuits for Plastic Shrink Small Outline Package (P-SSOP) Only English version
EDR-7315B Design guide for semiconductor packages Ball Grid Array (BGA) Only English version
EDR-7316A Design guideline of integrated circuits for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) Only English version
EDR-7316C Design guideline of integrated circuits for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA／FLGA) Only English version
EDR-7317 Design guideline of integrated circuits for Surface Vertical Package (SVP) Only English version
EDR-7318A Design guideline of integrated circuits for Plastic Small Outline Non-Leaded Package (P-SON) Only English version
EDR-7319 Design guideline of integrated circuits for Quad Flat J-Lead Packages (QFJ) Only English version
EDR-7320 Design guideline of integrated circuits for Small Outline Package (SOP) Only English version
EDR-7321 Design guideline of integrated circuits for Quad Flat I-lead package (QFI) Only English version
EDR-7322 Design guideline of integrated circuits for Plastic Dual Inline Package (DIP) Only English version
EDR-7323A Design guideline of integrated circuits for Pin Grid Array (PGA) Only English version
EDR-7324A Design guideline of integrated circuits for Plastic Quad Flat Non-leaded package (P-QFN) Only English version
EDR-7325 Design guideline of integrated circuits for Quad Flat Non-leaded packages (QFN) Only English version
EDR-7326A Design guideline of integrated circuits for Plastic Small Outline Package with Heat sink (P-HSOP) Only English version
EDR-7327 Design guideline of integrated circuits for Single Inline Package (SIP) Only English version
EDR-7328 Design guideline of integrated circuits for Plastic Zigzag Inline Package (P-ZIP) Only English version
EDR-7329 Design guideline of integrated circuits for Plastic Interstitial Land Grid Array package (P-ILGA) Only English version
EDR-7330 Design guideline of integrated circuits for Plastic Small Outline J-Lead package (P-SOJ) Only English version
EDR-7331 Design guideline of Integrated circuits for Quad Tape Carrier packages Carrier (QTP and Carrier) Only English version
EDR-7332 Design guideline of integrated circuits for Dual Tape Carrier packages (Type 1, Type 2)(DTP(1), DTP(2)) Only English version
EDR-7602 Design guideline of tray for integrated circuits Only English version
EDR-7603 Design guideline of low stacking profile tray for Ball Grid Array packages Only English version
EDR-7604 Technical Report for Measuring Method of Tray Only English version
EDR-7605 Marking guideline of packing for lead-free semiconductor device Only English version
EDR-7711 Design guideline of open-top type socket for Ball Grid Array (BGA) Only English version
EDR-7712 Design guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) Only English version
EDR-7713 Design guideline of clamshell type socket for Fine-pitch Ball Grid Array and Fine-Pitch Land Grid Array (FBGA/FLGA) Only English version
EDX-7619 Thick tray for Ball Grid Array packages Only English version

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